A hologram transfer foil according to an embodiment is thermally transferrable to a transfer base member. The hologram transfer foil has a structure configured such that a peeling layer, a diffraction structure forming layer and an adhesive layer are stacked on one surface of a substrate. the diffraction structure forming layer includes fine concaves and convexes of a hologram or a diffraction grating. At least one of the peeling layer and the adhesive layer includes heat-conductive hidden information in a heat-conductive hidden information possession portion.