Invention Grant
- Patent Title: Memory modules and memory systems
- Patent Title (中): 内存模块和内存系统
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Application No.: US14083033Application Date: 2013-11-18
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Publication No.: US09558805B2Publication Date: 2017-01-31
- Inventor: Uk-Song Kang , Chul-Woo Park , Hak-Soo Yu , Jong-Pil Son
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si, Gyeonggi-do
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si, Gyeonggi-do
- Agency: F. Chau & Associates, LLC
- Priority: KR10-2012-0155872 20121228
- Main IPC: G06F13/00
- IPC: G06F13/00 ; G11C11/406 ; G11C11/408

Abstract:
A memory module includes a plurality of memory devices and a buffer chip. The buffer chip manages the memory devices. The buffer chip includes a refresh control circuit that groups a plurality of memory cell rows of the memory devices into a plurality of groups according to a data retention time of tire memory cell rows. The buffer chip selectively refreshes each of the plurality of groups in each of a plurality of refresh time regions that are periodically repeated and applies respective refresh periods to the plurality of groups, respectively.
Public/Granted literature
- US20140189215A1 MEMORY MODULES AND MEMORY SYSTEMS Public/Granted day:2014-07-03
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