发明授权
- 专利标题： Chip package and method for forming the same
- 专利标题（中）： 芯片封装及其形成方法
-
申请号： US13024156申请日： 2011-02-09
-
公开(公告)号： US09559001B2公开(公告)日： 2017-01-31
- 发明人: Yu-Lin Yen , Ming-Kun Yang , Tsang-Yu Liu , Long-Sheng Yeou
- 申请人： Yu-Lin Yen , Ming-Kun Yang , Tsang-Yu Liu , Long-Sheng Yeou
- 申请人地址： TW Taoyuan
- 专利权人： XINTEC INC.
- 当前专利权人： XINTEC INC.
- 当前专利权人地址： TW Taoyuan
- 代理机构： Liu & Liu
- 主分类号： H01L23/48
- IPC分类号： H01L23/48 ; H01L23/52 ; H01L29/40 ; H01L21/4763 ; H01L23/58 ; H01L21/768 ; H01L21/48 ; H01L23/498 ; H01L23/00
摘要：
According to an embodiment of the invention, a chip package is provided, which includes: a substrate having an upper surface and a lower surface; a hole extending from the upper surface toward the lower surface; an insulating layer located overlying a sidewall of the hole; and a material layer located overlying the sidewall of the hole, wherein the material layer is separated from the upper surface of the substrate by a distance and a thickness of the material layer decreases along a direction toward the lower surface.
公开/授权文献
- US20110193241A1 CHIP PACKAGE AND METHOD FOR FORMING THE SAME 公开/授权日：2011-08-11
信息查询
IPC分类:
