Invention Grant
- Patent Title: Semiconductor devices and methods of manufacturing the same
- Patent Title (中): 半导体器件及其制造方法
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Application No.: US15134906Application Date: 2016-04-21
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Publication No.: US09559185B2Publication Date: 2017-01-31
- Inventor: Yong-Suk Tak , Gyeom Kim , Ki-Yeon Park , Sung-Hyun Choi , Bon-Young Koo
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si, Gyeonggi-Do
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si, Gyeonggi-Do
- Agency: F. Chau & Assoicats, LLC
- Priority: KR10-2015-0086305 20150618
- Main IPC: H01L21/02
- IPC: H01L21/02 ; H01L29/66 ; H01L29/78 ; H01L29/161 ; H01L29/165 ; H01L29/08 ; H01L29/06

Abstract:
A semiconductor device includes a substrate including an active fin structure, a plurality of gate structures, a first spacer on sidewalls of each of the gate structures, and a second spacer on sidewalls of the first spacer. The active fin structure may extend in a first direction and including a plurality of active fins with adjacent active fins divided by a recess. Each of the plurality of gate structures may extend in a second direction crossing the first direction, and may cover the active fins. The first spacer may include silicon oxycarbonitride (SiOCN), and may have a first carbon concentration. The second spacer may include SiOCN and may have a second carbon concentration which is different from the first carbon concentration. The semiconductor device may have a low parasitic capacitance and good electrical characteristics.
Public/Granted literature
- US20160372567A1 SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THE SAME Public/Granted day:2016-12-22
Information query
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