Invention Grant
- Patent Title: Printed wiring board and connector connecting the wiring board
- Patent Title (中): 印刷线路板和连接接线板的连接器
-
Application No.: US14916473Application Date: 2014-09-04
-
Publication No.: US09559449B2Publication Date: 2017-01-31
- Inventor: Yuki Ishida , Masayuki Suzuki , Yuki Nakano , Harunori Urai , Norifumi Nagae
- Applicant: FUJIKURA LTD. , DDK LTD.
- Applicant Address: JP Tokyo JP Tokyo
- Assignee: FUJIKURA LTD.,DDK Ltd.
- Current Assignee: FUJIKURA LTD.,DDK Ltd.
- Current Assignee Address: JP Tokyo JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP2013-184072 20130905
- International Application: PCT/JP2014/073378 WO 20140904
- International Announcement: WO2015/034017 WO 20150312
- Main IPC: H01R12/73
- IPC: H01R12/73 ; H05K1/11 ; H01R12/77 ; H01R12/88

Abstract:
A printed wiring board (1) includes: a base substrate (3); a plurality of pads (15a, 17a) for electrical connection that are disposed at one surface side of the base substrate (3) and at a connection end portion (13) to be connected with another electronic component (50); wirings (9, 11) that are connected with the pads (15a, 17a); and engageable parts (28, 29) that are formed at side edge parts of the connection end portion (13) and are to be engaged with engagement parts (58) of the other electronic component (50) in the direction of disconnection. The flexible printed wiring board (1) further includes: reinforcement layers (31, 32) that are disposed at the one surface side of the base substrate (3) and at a frontward side with respect to the engageable parts (28, 29) when viewed in the direction of connection with the other electronic component and that are formed integrally with the pads (15a); and insulating layers (34, 35) that cover the reinforcement layers (31, 32).
Public/Granted literature
- US20160204531A1 PRINTED WIRING BOARD AND CONNECTOR CONNECTING THE WIRING BOARD Public/Granted day:2016-07-14
Information query
IPC分类: