Invention Grant
- Patent Title: Packaging apparatus
- Patent Title (中): 包装设备
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Application No.: US13983631Application Date: 2013-06-29
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Publication No.: US09561896B2Publication Date: 2017-02-07
- Inventor: Qianshuang Hu , Shih Hsiang Chen , Chengwen Que , Yi Cheng Kuo
- Applicant: SHENZHEN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Applicant Address: CN Shenzhen
- Assignee: SHENZEHN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD
- Current Assignee: SHENZEHN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD
- Current Assignee Address: CN Shenzhen
- Priority: CN201310163370 20130506
- International Application: PCT/CN2013/078513 WO 20130629
- International Announcement: WO2014/180062 WO 20141113
- Main IPC: B65D85/48
- IPC: B65D85/48 ; B65D85/38 ; B65D81/05 ; B65D21/02 ; B65D25/10
Abstract:
The present invention discloses a packaging apparatus, comprising multiple packaging elements, each packaging element comprises a slot for receiving a LCD module, and the packaging apparatus further comprises a connecting means for integrating the multiple packaging elements side by side. Therefore, the packaging apparatus can be used for both LCD modules and end-products such as TV, display devices, the packaging cost can be reduced.
Public/Granted literature
- US20160046433A1 PACKAGING APPARATUS Public/Granted day:2016-02-18
Information query
IPC分类:
