Invention Grant
- Patent Title: Technology for temperature sensitive components in thermal processing
- Patent Title (中): 热处理中的温度敏感元件技术
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Application No.: US15062196Application Date: 2016-03-07
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Publication No.: US09563739B2Publication Date: 2017-02-07
- Inventor: Mitchell G. Ferrill , Curtis Grosskopf , Matthew S. Kelly , Thomas H. Lewis , Wen Wei Low
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agent Anthony V. S. England; Damion C. Josephs
- Main IPC: G06F17/50
- IPC: G06F17/50

Abstract:
For a printed circuit board assembly (“PCBA”) selected electronic components are highlighted on a graphic representation of the PCBA on a display of a computer system. The components are selected responsive to temperature and time limits of the selected components. Ones of the highlighted components are associated to respective temperature sensors on the PCBA. Responsive to where the one or more additional ones of the highlighted components are located on the PCBA relative to the at least one of the respective temperature sensors, one or more additional ones of the highlighted components are associated with at least one of the respective temperature sensors. The computer system receives data for respective signals indicating temperatures encountered by the respective temperature sensors when the PCBA is heated in a manufacturing process. The computer system shows whether any of the time and temperature limits were exceeded during the manufacturing process.
Public/Granted literature
- US20160188786A1 TECHNOLOGY FOR TEMPERATURE SENSITIVE COMPONENTS IN THERMAL PROCESSING Public/Granted day:2016-06-30
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