Invention Grant
- Patent Title: Systems and methods for determining a seam
- Patent Title (中): 用于确定接缝的系统和方法
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Application No.: US14811489Application Date: 2015-07-28
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Publication No.: US09563953B2Publication Date: 2017-02-07
- Inventor: Lei Xu , Yunke Pan , Shuxue Quan , Yingen Xiong , Ning Bi
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Agency: Austin Rapp & Hardman
- Main IPC: G06T7/00
- IPC: G06T7/00 ; G06T3/40 ; H04N5/232 ; G06T5/50 ; G06T7/20

Abstract:
A method performed by an electronic device is described. The method includes determining overlapping areas from neighboring images. The method also includes determining a difference measure between the overlapping areas. The method further includes determining a constraint measure corresponding to at least one of the overlapping areas. The method additionally includes determining a seam based on a combination of the difference measure and the constraint measure.
Public/Granted literature
- US20160063705A1 SYSTEMS AND METHODS FOR DETERMINING A SEAM Public/Granted day:2016-03-03
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