Invention Grant
- Patent Title: Memory chip and layout design for manufacturing same
- Patent Title (中): 内存芯片和布局设计制造相同
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Application No.: US14317146Application Date: 2014-06-27
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Publication No.: US09564211B2Publication Date: 2017-02-07
- Inventor: Jhon Jhy Liaw
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Applicant Address: TW
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee Address: TW
- Agency: Hauptman Ham, LLP
- Main IPC: G11C11/00
- IPC: G11C11/00 ; G11C11/419

Abstract:
A static random access memory (SRAM) chip including a plurality of SRAM cells and a plurality of cell current tracking cells. Each of the SRAM cells include a source voltage reference conductor, a first ground reference conductor, two cross-coupled inverters, and two pass-gate devices. Each cell current tracking cell include a first half-cell and a second half-cell. The first half-cell is different from the second half-cell.
Public/Granted literature
- US20150380078A1 MEMORY CHIP AND LAYOUT DESIGN FOR MANUFACTURING SAME Public/Granted day:2015-12-31
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