Invention Grant
- Patent Title: Wireless chip and electronic device having wireless chip
- Patent Title (中): 无线芯片和具有无线芯片的电子设备
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Application No.: US15155096Application Date: 2016-05-16
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Publication No.: US09564688B2Publication Date: 2017-02-07
- Inventor: Yukie Suzuki , Yasuyuki Arai , Shunpei Yamazaki
- Applicant: Semiconductor Energy Laboratory Co., Ltd.
- Applicant Address: JP Kanagawa-ken
- Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee Address: JP Kanagawa-ken
- Agency: Robinson Intellectual Property Law Office
- Agent Eric J. Robinson
- Priority: JP2005-103233 20050331
- Main IPC: H01L27/108
- IPC: H01L27/108 ; H01Q9/04 ; G06K19/077 ; H01Q1/22 ; H01Q23/00 ; H01L23/66 ; H01L23/00 ; H01L27/088 ; H01M10/04 ; H01M10/46

Abstract:
It is an object to provide a wireless chip which can increase a mechanical strength, and a wireless chip with a high durability. A wireless chip includes a transistor including a field-effect transistor, an antenna including a dielectric layer sandwiched between conductive layers, and a conductive layer connecting the chip and the antenna. Further, a wireless chip includes a transistor including a field-effect transistor, an antenna including a dielectric layer sandwiched between conductive layers, a sensor device, a conductive layer connecting the chip and the antenna, and a conductive layer connecting the chip and the sensor device. Moreover, a wireless chip includes a transistor including a field-effect transistor, an antenna including a dielectric layer sandwiched between conductive layers, a battery, a conductive layer connecting the chip and the antenna, and a conductive layer connecting the chip and the battery.
Public/Granted literature
- US20160261048A1 WIRELESS CHIP AND ELECTRONIC DEVICE HAVING WIRELESS CHIP Public/Granted day:2016-09-08
Information query
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