Invention Grant
- Patent Title: Device support stand assembly
- Patent Title (中): 设备支撑架组件
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Application No.: US14892020Application Date: 2013-06-28
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Publication No.: US09565909B2Publication Date: 2017-02-14
- Inventor: Ki Bok Song , Eric Chen , Ilchan Lee
- Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Applicant Address: US TX Houston
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Houston
- Agency: HP Patent Department
- International Application: PCT/US2013/048494 WO 20130628
- International Announcement: WO2014/209343 WO 20141231
- Main IPC: G06F1/16
- IPC: G06F1/16 ; A45C11/00 ; F16M11/04 ; F16M11/20
Abstract:
Implementations of the present disclosure disclose a device support stand assembly. According to one implementation, the assembly includes a removable support stand member having an attachment feature for coupling to a corresponding mating element formed on a rear side of a portable electronic device. In addition, the support stand member includes a tension spring configured for dual operating positions with respect to the portable electronic device.
Public/Granted literature
- US20160106190A1 DEVICE SUPPORT STAND ASSEMBLY Public/Granted day:2016-04-21
Information query
