Invention Grant
- Patent Title: Manifold assembly
- Patent Title (中): 歧管装配
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Application No.: US14319010Application Date: 2014-06-30
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Publication No.: US09568138B2Publication Date: 2017-02-14
- Inventor: Ron Arizpe , Lun Tsuei , Timothy Long , Adam Hardman , Matthew Green
- Applicant: S.P.M. Flow Control, Inc.
- Applicant Address: US TX Fort Worth
- Assignee: S.P.M. FLOW CONTROL, INC.
- Current Assignee: S.P.M. FLOW CONTROL, INC.
- Current Assignee Address: US TX Fort Worth
- Agency: Haynes and Boone, LLP
- Main IPC: F16L55/035
- IPC: F16L55/035 ; F16L41/03 ; E21B43/26 ; F16F7/14

Abstract:
According to one aspect, a manifold assembly includes a skid, a low pressure manifold connected to the skid, and a high pressure manifold connected to the skid. In another aspect, the high pressure manifold has a modular configuration so that the high pressure manifold is disconnectable in whole or in part from the skid, and reconnectable in whole or in part to the skid. In yet another aspect, the high pressure manifold includes high pressure modules, all of which are in fluid communication with each other and each of which is adapted to be in fluid communication with at least one pump. In still yet another aspect, the low pressure manifold includes one or more flow lines, the high pressure manifold includes fittings, and the manifold assembly includes vibration isolators to dampen dynamic loading, the vibration isolators being disposed between the fittings and the one or more flow lines.
Public/Granted literature
- US20150000766A1 MANIFOLD ASSEMBLY Public/Granted day:2015-01-01
Information query
IPC分类: