Invention Grant
- Patent Title: Ultra-wideband assembly system and method
- Patent Title (中): 超宽带组装系统及方法
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Application No.: US14444576Application Date: 2014-07-28
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Publication No.: US09570238B2Publication Date: 2017-02-14
- Inventor: John Mruz
- Applicant: American Technical Ceramics Corp.
- Applicant Address: US NY Huntington Station
- Assignee: American Technical Ceramics Corp.
- Current Assignee: American Technical Ceramics Corp.
- Current Assignee Address: US NY Huntington Station
- Agency: Mintz Levin Cohn Ferris Glovsky and Popeo, P.C.
- Main IPC: H05K7/00
- IPC: H05K7/00 ; H01G4/40 ; H01F17/04 ; H01F27/06 ; H03H7/01 ; H01F5/00 ; H05K1/02

Abstract:
An ultra-wideband assembly is provided. The assembly includes a non-conductive tapered core having a conductive wire wound on an outer surface of the non-conductive tapered core, a low-frequency inductor coupled to the non-conductive tapered core via the distal end of the conductive wire and configured to allow mounting of the non-conductive tapered core at an angle with respect to the circuit board. The low frequency inductor is being disposed on a dielectric board configured to be coupled to the circuit board. The assembly includes an ultra-wideband capacitor coupled to the non-conductive tapered core via the proximate end of the conductive wire, the ultra-wideband capacitor being also coupled to the transmission line on the dielectric board.
Public/Granted literature
- US20140333393A1 Ultra-Wideband Assembly System And Method Public/Granted day:2014-11-13
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