Invention Grant
US09570411B2 Pad structure of a semiconductor device, method of manufacturing the pad structure and semiconductor package including the pad structure 有权
半导体器件的衬垫结构,衬垫结构的制造方法以及包括焊盘结构的半导体封装

Pad structure of a semiconductor device, method of manufacturing the pad structure and semiconductor package including the pad structure
Abstract:
A pad structure usable with a semiconductor device may include an insulating layer pattern structure, a plug, and a pad. The insulating layer pattern structure has a plug hole and at least one via hole. The plug is formed in the plug hole. The pad is formed on the insulating layer pattern structure. The pad is electrically connected with the plug and has a lower surface and an uneven upper surface. The lower surface includes a protruded portion inserted into the via hole. The uneven upper surface includes a recessed portion and an elevated portion—to provide high roughness and firm connection.
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