Invention Grant
- Patent Title: Articles including bonded metal structures and methods of preparing the same
- Patent Title (中): 包括粘结金属结构的制品及其制备方法
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Application No.: US14709924Application Date: 2015-05-12
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Publication No.: US09570430B2Publication Date: 2017-02-14
- Inventor: Frank Kuechenmeister , Christian Klewer , Jens Oswald
- Applicant: GLOBALFOUNDRIES, Inc.
- Applicant Address: KY Grand Cayman
- Assignee: GLOBALFOUNDRIES, INC.
- Current Assignee: GLOBALFOUNDRIES, INC.
- Current Assignee Address: KY Grand Cayman
- Agency: Lorenz & Kopf, LLP
- Main IPC: H01L25/00
- IPC: H01L25/00 ; H01L23/00 ; H01L25/065 ; H01L23/31
Abstract:
Articles including bonded metal structures and methods of preparing the same are provided herein. In an embodiment, a method of preparing an article that includes bonded metal structures includes providing a first substrate. A first metal structure and a second metal structure are formed on the first substrate. The first metal structure and the second metal structure each include an exposed contact surface. A bond mask is formed over the contact surface of the first metal structure. A second substrate is bonded to the first substrate through the exposed contact surface of the second metal structure. The bond mask remains disposed over the exposed contact surface of the second metal structure during bonding of the second substrate to the first substrate. A wire is bonded to the exposed contact surface of the first metal structure.
Public/Granted literature
- US20150333035A1 ARTICLES INCLUDING BONDED METAL STRUCTURES AND METHODS OF PREPARING THE SAME Public/Granted day:2015-11-19
Information query
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