Invention Grant
- Patent Title: Chassis with distributed jet cooling
- Patent Title (中): 底盘分布式喷射冷却
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Application No.: US14449452Application Date: 2014-08-01
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Publication No.: US09572280B2Publication Date: 2017-02-14
- Inventor: Mehmet Arik , William Dwight Gerstler , Ri Li , Earl Ross Nicewarner , Christina Clyde Schroeder , Benjamin Jon Vander Ploeg , Bryan Patrick Whalen
- Applicant: General Electric Company
- Applicant Address: US NY Schenectady
- Assignee: General Electric Company
- Current Assignee: General Electric Company
- Current Assignee Address: US NY Schenectady
- Agency: Ziolkowski Patent Solutions Group, SC
- Agent Jean K. Testa
- Main IPC: H05K7/20
- IPC: H05K7/20 ; F24F13/02

Abstract:
A chassis with distributed jet cooling is provided. The chassis includes one or more sidewalls defining a volume configured to substantially surround one or more heat generating components positioned within the volume. The chassis further includes at least one array of fins thermally coupled to a respective one of the one or more sidewalls and at least one synthetic jet assembly comprising a multi-orifice synthetic jet or a number of single orifice synthetic jets disposed on a side of a respective one of the array(s) of fins. The chassis further includes at least one attachment means for attaching a respective one of the at least one synthetic jet assemblies to a respective one of the one or more sidewalls.
Public/Granted literature
- US20140338861A1 CHASSIS WITH DISTRIBUTED JET COOLING Public/Granted day:2014-11-20
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