Invention Grant
US09573369B2 Fluid ejection assembly with controlled adhesive bond 有权
具有受控粘合剂粘合剂的流体喷射组件

Fluid ejection assembly with controlled adhesive bond
Abstract:
In an embodiment, a fluid ejection device includes a die including a fluid feed slot that extends from a back side to a front side of the die, a firing chamber formed on the front side to receive fluid from the feed slot, a fluid distribution manifold adhered to the back side to provide fluid to the feed slot, and a corrosion-resistant layer coating the back side of the die so as not to extend into the feed slot.
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