Invention Grant
- Patent Title: Fluid ejection assembly with controlled adhesive bond
- Patent Title (中): 具有受控粘合剂粘合剂的流体喷射组件
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Application No.: US14418433Application Date: 2012-09-19
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Publication No.: US09573369B2Publication Date: 2017-02-21
- Inventor: Rio Rivas , Ed Friesen
- Applicant: Hewlett-Packard Development Company, L.P.
- Applicant Address: US TX Houston
- Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Current Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Current Assignee Address: US TX Houston
- Agency: HP Inc Patent Department
- International Application: PCT/US2012/056115 WO 20120919
- International Announcement: WO2014/046652 WO 20140327
- Main IPC: B41J2/16
- IPC: B41J2/16 ; B41J2/14

Abstract:
In an embodiment, a fluid ejection device includes a die including a fluid feed slot that extends from a back side to a front side of the die, a firing chamber formed on the front side to receive fluid from the feed slot, a fluid distribution manifold adhered to the back side to provide fluid to the feed slot, and a corrosion-resistant layer coating the back side of the die so as not to extend into the feed slot.
Public/Granted literature
- US20150210076A1 FLUID EJECTION ASSEMBLY WITH CONTROLLED ADHESIVE BOND Public/Granted day:2015-07-30
Information query
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