Invention Grant
US09573835B2 Non-polished glass wafer, thinning system and method for using the non-polished glass wafer to thin a semiconductor wafer
有权
非抛光玻璃晶片，变薄系统以及使用非抛光玻璃晶片来稀薄半导体晶片的方法
- Patent Title: Non-polished glass wafer, thinning system and method for using the non-polished glass wafer to thin a semiconductor wafer
- Patent Title (中): 非抛光玻璃晶片，变薄系统以及使用非抛光玻璃晶片来稀薄半导体晶片的方法
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Application No.: US14966730Application Date: 2015-12-11
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Publication No.: US09573835B2Publication Date: 2017-02-21
- Inventor: Shawn Rachelle Markham , Windsor Pipes Thomas, III
- Applicant: CORNING INCORPORATED
- Applicant Address: US NY Corning
- Assignee: CORNING INCORPORATED
- Current Assignee: CORNING INCORPORATED
- Current Assignee Address: US NY Corning
- Agent John T. Haran
- Main IPC: B44C1/22
- IPC: B44C1/22 ; C03B33/02 ; B24B1/00 ; B24B7/22 ; B24B37/04 ; H01L21/304 ; H01L21/306 ; C03B17/06 ; H01L21/683
Abstract:
A non-polished glass wafer, a thinning system, and a method for using the non-polished glass wafer to thin a semiconductor wafer are described herein. In one embodiment, the glass wafer has a body (e.g., circular body) including a non-polished first surface and a non-polished second surface substantially parallel to each other. In addition, the circular body has a wafer quality index which is equal to a total thickness variation in micrometers plus one-tenth of a warp in micrometers that is less than 6.0.
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