Invention Grant
- Patent Title: Sensor temperature sensing device
- Patent Title (中): 传感器温度检测装置
-
Application No.: US14183202Application Date: 2014-02-18
-
Publication No.: US09574947B2Publication Date: 2017-02-21
- Inventor: Barrett E. Cole , Robert E. Higashi , Peter Tobias
- Applicant: Honeywell International Inc.
- Applicant Address: US NJ Morris Plains
- Assignee: Honeywell International Inc.
- Current Assignee: Honeywell International Inc.
- Current Assignee Address: US NJ Morris Plains
- Agency: Brooks, Cameron & Huebsch, PLLC
- Main IPC: G01K7/00
- IPC: G01K7/00 ; G01K7/02 ; G01K7/18 ; G01N27/12

Abstract:
The present disclosure includes sensing device embodiments. One sensing device includes a heater layer, a resistance detector layer, constructed and arranged to indicate a temperature value based upon a correlation to a detected resistance value, an electrode layer, and a sensing layer.
Public/Granted literature
- US20140161153A1 SENSOR TEMPERATURE SENSING DEVICE Public/Granted day:2014-06-12
Information query