Invention Grant
- Patent Title: Coil component and board having the same
- Patent Title (中): 线圈组件和板具有相同的
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Application No.: US14625297Application Date: 2015-02-18
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Publication No.: US09576711B2Publication Date: 2017-02-21
- Inventor: Chan Yoon , Dong Hwan Lee , Young Ghyu Ahn
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-Si, Gyeonggi-Do
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-Si, Gyeonggi-Do
- Agency: McDermott Will & Emery LLP
- Priority: KR10-2014-0122895 20140916
- Main IPC: H01F27/28
- IPC: H01F27/28 ; H01F5/00 ; H01F5/04 ; H01F3/00 ; H01F17/00 ; H01F27/29

Abstract:
There are provided a coil component and a board having the same. The coil component includes: a magnetic body including a substrate having two cores, first and second coil parts disposed on one surface of the substrate and wound in the same direction, and third and fourth coil parts disposed on the other surface of the substrate to be spaced apart from each other; and first to fourth external electrodes disposed on outer surfaces of the magnetic body and connected to the first to fourth coil parts.
Public/Granted literature
- US20160078986A1 COIL COMPONENT AND BOARD HAVING THE SAME Public/Granted day:2016-03-17
Information query