发明授权
- 专利标题： Composition for electronic device
- 专利标题（中）： 电子设备组成
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申请号： US14200525申请日： 2014-03-07
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公开(公告)号： US09576871B2公开(公告)日： 2017-02-21
- 发明人: Yusuke Horiguchi , Kenichiro Sato , Mieko Sano
- 申请人： HENKEL AG & CO KGAA
- 申请人地址： DE Duesseldorf
- 专利权人： HENKEL AG & CO. KGAA
- 当前专利权人： HENKEL AG & CO. KGAA
- 当前专利权人地址： DE Duesseldorf
- 代理商 James J. Cummings
- 主分类号： H01L23/29
- IPC分类号： H01L23/29 ; H01L23/00 ; H01L21/56 ; C09D4/00 ; C09D133/14 ; C08K9/04 ; C08K5/3415
摘要：
The present invention provides a composition of which viscosity does not cause the problem of use at high temperature in the mounting process of electronic device. The present invention relates to a composition for electronic device comprising (a) a (meth)acrylic compound and (c) a particle having a functional group having metal scavenging functionality.
公开/授权文献
- US20140187659A1 COMPOSITION FOR ELECTRONIC DEVICE 公开/授权日：2014-07-03
信息查询
IPC分类:
