Invention Grant
- Patent Title: Semiconductor device having strained channel layer and method of manufacturing the same
- Patent Title (中): 具有应变通道层的半导体器件及其制造方法
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Application No.: US14992683Application Date: 2016-01-11
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Publication No.: US09576955B2Publication Date: 2017-02-21
- Inventor: Jae Hwan Lee , Tae Yong Kwon , Sang Su Kim , Chang Jae Yang , Jung Han Lee , Hwan Wook Choi , Yeon Cheol Heo , Sang Hyuk Hong
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR
- Agency: Myers Bigel, P.A.
- Priority: KR10-2015-0062538 20150504
- Main IPC: H01L21/84
- IPC: H01L21/84 ; H01L27/088 ; H01L29/78 ; H01L29/10 ; H01L29/161 ; H01L29/06

Abstract:
Semiconductor devices are provided. The semiconductor devices include active fins including a buffer layer disposed on a substrate and a channel layer disposed on the buffer layer and having a first second lattice constant higher than a lattice constant of the buffer layer, a gate structure covering the channel layer and intersecting the active fins, sidewall spacers disposed on both sidewalls of the gate structure, and capping layers disposed to contact lower surfaces of the sidewall spacers and having a width substantially the same as a width of the lower surfaces of the sidewall spacers.
Public/Granted literature
- US20160329327A1 Semiconductor Device Having Strained Channel Layer and Method of Manufacturing the Same Public/Granted day:2016-11-10
Information query
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