发明授权
- 专利标题: Cutting tool
- 专利标题(中): 切割用具
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申请号: US14654786申请日: 2013-12-25
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公开(公告)号: US09579728B2公开(公告)日: 2017-02-28
- 发明人: Yoshiki Sakamoto
- 申请人: KYOCERA Corporation
- 申请人地址: JP Kyoto
- 专利权人: Kyocera Corporation
- 当前专利权人: Kyocera Corporation
- 当前专利权人地址: JP Kyoto
- 代理机构: Volpe and Koenig, P.C.
- 优先权: JP2012-285343 20121227
- 国际申请: PCT/JP2013/084700 WO 20131225
- 国际公布: WO2014/104111 WO 20140703
- 主分类号: B23B27/14
- IPC分类号: B23B27/14 ; C23C14/06 ; C23C30/00 ; C23C28/04 ; C23C28/00
摘要:
To provide a cutting tool that includes a coating layer capable of exhibiting optimum cutting performance in each of a cutting edge, rake face, and flank face. A cutting tool (1) includes a substrate (2) that is coated with a coating layer (6) composed of SiaM1-a(C1-xNx), where M represents at least one element selected from Ti, Al, Cr, W, Mo, Ta, Hf, Nb, Zr, and Y, 0.01≦a≦0.4, and 0≦x≦1, and that has a cutting edge (5) at an intersecting ridge line of a rake face (3) and a flank face (4). The Si content ratio in the coating layer (6) on the rake face (3) is higher than that on the cutting edge (5).
公开/授权文献
- US20150343535A1 CUTTING TOOL 公开/授权日:2015-12-03
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