Invention Grant
- Patent Title: Method for reducing formation of electrically resistive layer on ferritic stainless steels
- Patent Title (中): 减少铁素体不锈钢上电阻层形成的方法
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Application No.: US13873272Application Date: 2013-04-30
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Publication No.: US09580789B2Publication Date: 2017-02-28
- Inventor: James M. Rakowski
- Applicant: ATI Properties LLC
- Applicant Address: US OR Albany
- Assignee: ATI Properties LLC
- Current Assignee: ATI Properties LLC
- Current Assignee Address: US OR Albany
- Agency: K&L Gates LLP
- Main IPC: C23C8/10
- IPC: C23C8/10 ; H01M8/0202 ; C21D1/74 ; C21D3/02 ; C21D6/00 ; C23C8/08 ; H01M8/02 ; H01B1/02 ; H01M8/00 ; H01M4/64 ; H01M8/12

Abstract:
A method of reducing the formation of electrically resistive scale on a an article comprising a silicon-containing ferritic stainless subjected to oxidizing conditions in service includes, prior to placing the article in service, subjecting the article to conditions under which silica, which includes silicon derived from the steel, forms on a surface of the steel. Optionally, at least a portion of the silica is removed from the surface to placing the article in service. A ferritic stainless steel alloy having a reduced tendency to form silica on at least a surface thereof also is provided. The steel includes a near-surface region that has been depleted of silicon relative to a remainder of the steel.
Public/Granted literature
- US20130266892A1 METHOD FOR REDUCING FORMATION OF ELECTRICALLY RESISTIVE LAYER ON FERRITIC STAINLESS STEELS Public/Granted day:2013-10-10
Information query
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