Invention Grant
- Patent Title: Roundness measuring apparatus
- Patent Title (中): 圆度测量仪
-
Application No.: US14565058Application Date: 2014-12-09
-
Publication No.: US09581424B2Publication Date: 2017-02-28
- Inventor: Ryo Takanashi
- Applicant: Tokyo Seimitsu Co., Ltd.
- Applicant Address: JP Tokyo
- Assignee: Tokyo Seimitsu Co., Ltd.
- Current Assignee: Tokyo Seimitsu Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Lewis Roca Rothgerber Christie LLP
- Main IPC: G01B5/20
- IPC: G01B5/20 ; G01B5/00

Abstract:
A roundness measuring apparatus, which has a small space required for installation and of which measurement error due to a temperature change is small, is disclosed. The roundness measuring apparatus includes: a base; a turn-table which is fixed to the base and rotates a work placed on the turn-table; a two-dimensional moving mechanism provided at the base so as to move a holder holding part in parallel to a measurement plane including a rotation axis of the turn-table and a measuring point of the work; a detector holder attached to the holder holding part; and a detector attached to the detector holder so that a probe can be displaced on the measurement plane.
Public/Granted literature
- US20160161239A1 ROUNDNESS MEASURING APPARATUS Public/Granted day:2016-06-09
Information query