Invention Grant
US09583305B2 Exposure method using control of settling times and methods of manufacturing integrated circuit devices by using the same
有权
使用沉淀时间的控制的曝光方法和使用该方法制造集成电路器件的方法
- Patent Title: Exposure method using control of settling times and methods of manufacturing integrated circuit devices by using the same
- Patent Title (中): 使用沉淀时间的控制的曝光方法和使用该方法制造集成电路器件的方法
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Application No.: US14632767Application Date: 2015-02-26
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Publication No.: US09583305B2Publication Date: 2017-02-28
- Inventor: Yong-Seok Jung , Shuichi Tamamushi , In-Hwan Noh , In-Kyun Shin , Sang-Hee Lee , Jin Choi
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Gyeonggi-do
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: KR10-2014-0073681 20140617
- Main IPC: H01J37/147
- IPC: H01J37/147 ; H01J37/317 ; H01J37/30

Abstract:
An exposure method may include: radiating a charged particle beam in an exposure system comprising a beam generator, radiating the beam, and main and auxiliary deflectors deflecting the beam to determine a position of a beam shot; determining whether a deflection distance from a first position of a latest radiated beam shot to a second position of a subsequent beam shot is within a first distance in a main field area of an exposure target area, the main field area having a size determined by the main deflector; setting a settling time according to the deflection distance so that a settling time of the subsequent beam shot is set to a constant minimum value, greater than zero, when the deflection distance from the first position to the second position is within the first distance; and deflecting the beam using the main deflector based on the set settling time.
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