Invention Grant
- Patent Title: Layer transferring process
- Patent Title (中): 层转移过程
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Application No.: US14957133Application Date: 2015-12-02
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Publication No.: US09583341B2Publication Date: 2017-02-28
- Inventor: Vivien Renauld , Monique Lecomte
- Applicant: Soitec
- Applicant Address: FR Bernin
- Assignee: Soitec
- Current Assignee: Soitec
- Current Assignee Address: FR Bernin
- Agency: TraskBritt
- Priority: FR1402800 20141204
- Main IPC: H01L21/30
- IPC: H01L21/30 ; H01L21/02 ; H01L21/762

Abstract:
A process for transferring a useful layer to a receiver substrate includes providing a donor substrate comprising an intermediate layer, a carrier substrate, and a useful layer. The intermediate layer is free of species liable to degas during a subsequent heat treatment, and is configured to become soft at a temperature. The receiver substrate and the donor substrate are assembled. An additional layer is provided between the receiver substrate and the carrier substrate that comprises chemical species that are susceptible to diffuse into the intermediate layer during the subsequent heat treatment so as to form a weak zone. The heat treatment is carried out on the receiver substrate and the donor substrate at a second temperature higher than the first temperature.
Public/Granted literature
- US20160163535A1 LAYER TRANSFERRING PROCESS Public/Granted day:2016-06-09
Information query
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