发明授权
- 专利标题： Method for transferring light-emitting elements onto a package substrate
- 专利标题（中）： 将发光元件转印到封装衬底上的方法
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申请号： US14886567申请日： 2015-10-19
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公开(公告)号： US09583450B2公开(公告)日： 2017-02-28
- 发明人: Yu-Chu Li , Yu-Hung Lai , Tzu-Yang Lin
- 申请人： PLAYNITRIDE INC.
- 申请人地址： TW Tainan
- 专利权人： PLAYNITRIDE INC.
- 当前专利权人： PLAYNITRIDE INC.
- 当前专利权人地址： TW Tainan
- 代理机构： Muncy, Geissler, Olds & Lowe, P.C.
- 优先权： TW103136144A 20141020
- 主分类号： H01L21/00
- IPC分类号： H01L21/00 ; H01L23/00
摘要：
A method for transferring light-emitting elements onto a package substrate includes: providing a light-emitting unit including a supporting substrate and a plurality of light-emitting elements, each of the light-emitting elements being removably connected to the supporting substrate and having a surface opposite to the supporting substrate; disposing the light-emitting unit spacingly above a package substrate in such a manner that the surface of each of the light-emitting elements faces the package substrate; and disconnecting the light-emitting elements from the supporting substrate to allow the light-emitting elements to fall onto the package substrate by gravity, so as to connect the light-emitting elements with the package substrate in a non-contact transferring method.
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