Invention Grant
- Patent Title: Substrate, chip arrangement, and method for manufacturing the same
- Patent Title (中): 基板，芯片布置及其制造方法
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Application No.: US14034669Application Date: 2013-09-24
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Publication No.: US09585241B2Publication Date: 2017-02-28
- Inventor: Wolfram Hable , Andreas Grassmann , Frank Winter , Ottmar Geitner , Alexander Schwarz , Alexander Herbrandt
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: INFINEON TECHNOLOGIES AG
- Current Assignee: INFINEON TECHNOLOGIES AG
- Current Assignee Address: DE Neubiberg
- Agency: Viering, Jentschura & Partner mbB
- Main IPC: H05K7/20
- IPC: H05K7/20 ; H05K1/02 ; H05K3/32 ; H01L23/31 ; H01L23/373 ; H01L21/48 ; H05K1/03 ; H01L23/467 ; H01L23/473 ; H01L23/498
Abstract:
In various embodiments, a substrate is provided. The substrate may include: a ceramic carrier having a first side and a second side opposite the first side; a first metal layer disposed over the first side of the ceramic carrier; a second metal layer disposed over the second side of the ceramic carrier; and a cooling structure formed into or over the second metal layer.
Public/Granted literature
- US20150085446A1 SUBSTRATE, CHIP ARRANGEMENT, AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2015-03-26
Information query
