Invention Grant
US09586207B2 Etching method for forming a carrier having inward side walls in particular for confining a droplet for capillary self-assembly
有权
用于形成具有向内侧壁的载体的蚀刻方法,特别是用于限制用于毛细管自组装的液滴
- Patent Title: Etching method for forming a carrier having inward side walls in particular for confining a droplet for capillary self-assembly
- Patent Title (中): 用于形成具有向内侧壁的载体的蚀刻方法,特别是用于限制用于毛细管自组装的液滴
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Application No.: US14903960Application Date: 2014-07-08
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Publication No.: US09586207B2Publication Date: 2017-03-07
- Inventor: Sebastien Mermoz , Lea Di Cioccio , Thomas Magis , Loic Sanchez
- Applicant: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES , STMICROELECTRONICS (CROLLES 2) SAS
- Applicant Address: FR Paris FR Crolles
- Assignee: Commissariat à l'énergie atomique et aux énergies alternatives,STMicroelectronics (Crolles 2) SAS
- Current Assignee: Commissariat à l'énergie atomique et aux énergies alternatives,STMicroelectronics (Crolles 2) SAS
- Current Assignee Address: FR Paris FR Crolles
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: FR1356719 20130709
- International Application: PCT/EP2014/064518 WO 20140708
- International Announcement: WO2015/004096 WO 20150115
- Main IPC: B44C1/22
- IPC: B44C1/22 ; C03C15/00 ; C03C25/68 ; C23F1/00 ; B01L3/00 ; B81C1/00 ; B81C3/00 ; B81B1/00 ; H01L23/13 ; H01L21/3065

Abstract:
A method for capillary self-assembly of a plate and a carrier, including: forming an etching mask on a region of a substrate; reactive-ion etching the substrate, the etching using a series of cycles each including isotropic etching followed by surface passivation, wherein a duration of the isotropic etching for each cycle increases from one cycle to another, a ratio between durations of the passivation and etching of each cycle is lower than a ratio for carrying out a vertical anisotropic etching to form a carrier having an upper surface defined by the region and side walls defining an acute angle with the upper surface; removing the etching mask; placing a droplet on the upper surface of the carrier; and placing the plate on the droplet.
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