A method includes providing a carrier wafer, forming an indented portion on the carrier wafer, the indented portion having a sloped portion at an edge of the indented portion, bonding a pellicle wafer on the carrier wafer so as to form an open area within the indented portion, patterning the pellicle wafer to form a pellicle membrane over the indented portion and a pellicle membrane support structure over the sloped portion, and applying a mechanical force to disconnect the pellicle membrane from the pellicle wafer.