Invention Grant
US09589343B2 Pattern measurement device, evaluation method of polymer compounds used in self-assembly lithography, and computer program
有权
图案测量装置,自组装光刻中使用的聚合物化合物的评估方法和计算机程序
- Patent Title: Pattern measurement device, evaluation method of polymer compounds used in self-assembly lithography, and computer program
- Patent Title (中): 图案测量装置,自组装光刻中使用的聚合物化合物的评估方法和计算机程序
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Application No.: US14422603Application Date: 2013-08-02
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Publication No.: US09589343B2Publication Date: 2017-03-07
- Inventor: Miki Isawa , Kei Sakai , Norio Hasegawa
- Applicant: Hitachi High-Technologies Corporation
- Applicant Address: JP Tokyo
- Assignee: Hitachi High-Technologies Corporation
- Current Assignee: Hitachi High-Technologies Corporation
- Current Assignee Address: JP Tokyo
- Agency: Crowell & Moring LLP
- Priority: JP2012-213385 20120927
- International Application: PCT/JP2013/070960 WO 20130802
- International Announcement: WO2014/050305 WO 20140403
- Main IPC: G06K9/00
- IPC: G06K9/00 ; G21K5/00 ; H01L21/31 ; G06T7/00 ; G01B15/00 ; G01B15/04 ; G06T7/60 ; G01N23/225 ; G06K9/46 ; G06K9/52 ; G06K9/62

Abstract:
The purpose of the present invention is to provide a pattern measurement device which evaluates quantitatively and with high precision random patterns such as finger print patterns. In order to fulfill this purpose, a pattern measurement device which measures the pattern on a sample on the basis of an image acquired by a charged particle beam is proposed which selectively extracts linear or linearly approximable parts of the pattern on the sample, and outputs at least one of the following: the measurement of the distance between the extracted parts, the ratio of said extracted parts in a prescribed region, and the length of said extracted parts. Further, as a more specific embodiment, a pattern measurement device is proposed which calculates a frequency depending on a distance value between extracted parts, and outputs, as a pattern distance, distance values for which said frequency fulfills a prescribed condition.
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