Invention Grant
US09589696B2 Semiconductor device using composition for anisotropic conductive adhesive film or anisotropic conductive adhesive film
有权
使用各向异性导电粘合膜或各向异性导电粘合膜的组合物的半导体器件
- Patent Title: Semiconductor device using composition for anisotropic conductive adhesive film or anisotropic conductive adhesive film
- Patent Title (中): 使用各向异性导电粘合膜或各向异性导电粘合膜的组合物的半导体器件
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Application No.: US13667146Application Date: 2012-11-02
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Publication No.: US09589696B2Publication Date: 2017-03-07
- Inventor: Hyun Hee Namkung , Jae Sun Han , Hyun Wook Kim , Jin Young Seo , Kwang Jin Jung , Dong Seon Uh
- Applicant: Hyun Hee Namkung , Jae Sun Han , Hyun Wook Kim , Jin Young Seo , Kwang Jin Jung , Dong Seon Uh
- Applicant Address: KR Gumi-Si, Kyeongsangbuk-Do
- Assignee: CHEIL INDUSTRIES, INC.
- Current Assignee: CHEIL INDUSTRIES, INC.
- Current Assignee Address: KR Gumi-Si, Kyeongsangbuk-Do
- Agency: Lee & Morse, P.C.
- Priority: KR10-2011-0114432 20111104
- Main IPC: H01B1/20
- IPC: H01B1/20 ; H01L23/00 ; H01B1/12 ; H01L23/482 ; H01B1/22 ; C09J9/02 ; C09J133/06 ; C08F230/02 ; C08F222/10
Abstract:
A semiconductor device bonded by an anisotropic conductive adhesive composition, the anisotropic conductive adhesive composition having a solid content ratio between a polymer binder system and a curing system of about 40:60 to about 60:40, and a coefficient of thermal expansion of about 150 ppm/° C. or less at about 100° C. or less.
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