Invention Grant
- Patent Title: Mounting table and plasma processing apparatus
- Patent Title (中): 安装台和等离子体处理装置
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Application No.: US14367058Application Date: 2012-12-17
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Publication No.: US09589823B2Publication Date: 2017-03-07
- Inventor: Yasuharu Sasaki , Takeshi Sugamata , Tadashi Aoto
- Applicant: TOKYO ELECTRON LIMITED
- Applicant Address: JP Tokyo
- Assignee: TOKYO ELECTRON LIMITED
- Current Assignee: TOKYO ELECTRON LIMITED
- Current Assignee Address: JP Tokyo
- Agency: Rothwell, Figg, Ernst & Manbeck, P.C.
- Priority: JP2011-278411 20111220
- International Application: PCT/JP2012/082681 WO 20121217
- International Announcement: WO2013/094564 WO 20130627
- Main IPC: B23K10/00
- IPC: B23K10/00 ; H01L21/683 ; H01L21/3065 ; H01J37/32
Abstract:
A mounting table includes an electrostatic chuck, a base, and a cylindrical sleeve. The electrostatic chuck has a top surface to be exposed to plasma and a bottom surface opposite to the top surface, and a first through-hole is formed through the electrostatic chuck. The base is bonded to the bottom surface of the electrostatic chuck by a first adhesive, and a second through-hole is formed through the base. The second through-hole communicates with the first through-hole and has a diameter larger than a diameter of the first through-hole. The sleeve is bonded to the bottom surface of the electrostatic chuck by a second adhesive while communicating with the first through-hole.
Public/Granted literature
- US20140346152A1 MOUNTING TABLE AND PLASMA PROCESSING APPARATUS Public/Granted day:2014-11-27
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