Invention Grant
US09589859B2 Semiconductor arrangement, method for producing a number of chip assemblies and method for producing a semiconductor arrangement 有权
半导体装置,用于制造多个芯片组件的方法和用于制造半导体装置的方法

Semiconductor arrangement, method for producing a number of chip assemblies and method for producing a semiconductor arrangement
Abstract:
A semiconductor arrangement includes a plurality of chip assemblies, each of which includes a semiconductor chip having a semiconductor body with a top side and an underside, a top main electrode arranged on the top side, a bottom main electrode arranged on the underside, an electrically conductive top compensation lamina arranged on a side of the top main electrode facing away from the semiconductor body and cohesively and electrically conductively connected to the top main electrode, an electrically conductive bottom compensation lamina arranged on a side of the bottom main electrode facing away from the semiconductor body and cohesively and electrically conductively connected to the bottom main electrode, and a dielectric embedding compound enclosing the semiconductor chip laterally circumferentially in a ring-shaped fashion such that the side of the compensation laminae facing away from the semiconductor body are at least not completely covered by the embedding compound.
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