A leadless chip carrier comprises a thermal pad for attaching to a printed circuit board (PCB) and an integrated circuit electrically connected to a plurality of electrical lead frame pads for connection to a plurality of corresponding pads on the PCB. The leadless chip carrier further comprises a non-collapsible conductive shim bonded to a first surface of the thermal pad and each of the plurality of electrical lead frame pads is attached to a volume of solder. The conductive shim provides a stand-off between the thermal pad and the PCB and improves the integrity of a joint between the thermal pad and the PCB.