Invention Grant
- Patent Title: Ultraviolet-erasable nonvolatile semiconductor device
- Patent Title (中): 紫外线可擦除非易失性半导体器件
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Application No.: US14769048Application Date: 2014-01-22
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Publication No.: US09589972B2Publication Date: 2017-03-07
- Inventor: Tetsuo Someya
- Applicant: SEIKO INSTRUMENTS INC.
- Applicant Address: JP
- Assignee: SII Semiconductor Corporation
- Current Assignee: SII Semiconductor Corporation
- Current Assignee Address: JP
- Agency: Adams & Wilks
- Priority: JP2013-032114 20130221
- International Application: PCT/JP2014/051182 WO 20140122
- International Announcement: WO2014/129252 WO 20140828
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L27/115 ; H01L23/31 ; H01L23/532 ; H01L27/144

Abstract:
An ultraviolet-erasable nonvolatile semiconductor device has a protective film comprised of a silicon nitride film on which is laminated a silicon oxynitride film. The silicon nitride film has a thickness of 1000 Å or more and 2000 Å or less and the silicon oxynitride film has a thickness of about 7000 Å or more. The silicon nitride film and the silicon oxynitride film cooperate to prevent moisture from penetrating into the ultraviolet-erasable nonvolatile semiconductor device. The thickness of the silicon nitride film is set so that the time for erasing data in a nonvolatile semiconductor storage element through irradiation with ultraviolet rays is not increased.
Public/Granted literature
- US20160005744A1 ULTRAVIOLET-ERASABLE NONVOLATILE SEMICONDUCTOR DEVICE Public/Granted day:2016-01-07
Information query
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