Invention Grant
- Patent Title: Solar cell assembly II
- Patent Title (中): 太阳能电池组件II
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Application No.: US13575281Application Date: 2011-02-23
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Publication No.: US09590126B2Publication Date: 2017-03-07
- Inventor: Martin Ziegler , Sascha Van Riesen
- Applicant: Martin Ziegler , Sascha Van Riesen
- Applicant Address: DE Freiburg
- Assignee: Soitec Solar GmbH
- Current Assignee: Soitec Solar GmbH
- Current Assignee Address: DE Freiburg
- Agency: TraskBritt
- Priority: EP10001966 20100225
- International Application: PCT/EP2011/000885 WO 20110223
- International Announcement: WO2011/104016 WO 20110901
- Main IPC: H01L31/18
- IPC: H01L31/18 ; H01L31/052 ; H01L31/0224
Abstract:
The present invention relates to a solar cell assembly that includes a solar cell attached to a bonding pad and a cooling substrate, wherein the bonding pad is attached to a surface of the cooling substrate by a thermally conductive adhesive and electrically contacted to the bonding pad and cooling substrate by a bonding wire. Alternatively, the bonding pad is attached to a surface of the cooling substrate by a thermally and electrically conductive adhesive.
Public/Granted literature
- US20120285530A1 SOLAR CELL ASSEMBLY II Public/Granted day:2012-11-15
Information query
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