Invention Grant
- Patent Title: OLED package device and package method of OLED panel
- Patent Title (中): OLED封装器件和OLED面板封装方法
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Application No.: US14384487Application Date: 2014-07-14
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Publication No.: US09590206B2Publication Date: 2017-03-07
- Inventor: Lindou Chen , Kai Shi
- Applicant: Shenzhen China Star Optoelectronics Technology Co., Ltd.
- Applicant Address: CN Shenzhen, Guangdong
- Assignee: Shenzhen China Star Optoelectronics Technology Co., Ltd
- Current Assignee: Shenzhen China Star Optoelectronics Technology Co., Ltd
- Current Assignee Address: CN Shenzhen, Guangdong
- Agent Andrew C. Cheng
- Priority: CN201410289640 20140624
- International Application: PCT/CN2014/082130 WO 20140714
- International Announcement: WO2015/196519 WO 20151230
- Main IPC: H01L51/52
- IPC: H01L51/52 ; H01L51/56 ; G09G3/34

Abstract:
The present invention provides an OLED package device and a package method of an OLED panel. The package device comprises: a base body (10), a lower stage (30) installed on the base body (10) and a heating device (50) installed between the base body (10) and the lower stage (30), and the lower stage (30) is employed to load a package plate, and the heating device (50) can heat the lower stage (30), and the lower stage (30) passes heat to the package plate for heating up the package plate. Using the device, it is capable of solving issue of existing bubbles in underfill which is under filled as implementing Dam & Fill package, and accordingly to improve the package result, to raise the performance of the OLED elements, and to extend the lifetime of the OLED elements.
Public/Granted literature
- US20160240812A1 OLED PACKAGE DEVICE AND PACKAGE METHOD OF OLED PANEL Public/Granted day:2016-08-18
Information query
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