Invention Grant
US09590206B2 OLED package device and package method of OLED panel 有权
OLED封装器件和OLED面板封装方法

OLED package device and package method of OLED panel
Abstract:
The present invention provides an OLED package device and a package method of an OLED panel. The package device comprises: a base body (10), a lower stage (30) installed on the base body (10) and a heating device (50) installed between the base body (10) and the lower stage (30), and the lower stage (30) is employed to load a package plate, and the heating device (50) can heat the lower stage (30), and the lower stage (30) passes heat to the package plate for heating up the package plate. Using the device, it is capable of solving issue of existing bubbles in underfill which is under filled as implementing Dam & Fill package, and accordingly to improve the package result, to raise the performance of the OLED elements, and to extend the lifetime of the OLED elements.
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