Invention Grant
- Patent Title: Method of manufacturing 3D barrier substrate
- Patent Title (中): 制造3D屏障基板的方法
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Application No.: US14353792Application Date: 2013-12-17
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Publication No.: US09590231B2Publication Date: 2017-03-07
- Inventor: Huibin Guo , Shoukun Wang , Xiaowei Liu , Xiaming Zhu , Zongjie Guo
- Applicant: BOE TECHNOLOGY GROUP CO., LTD. , BEIJING BOE DISPLAY TECHNOLOGY CO., LTD.
- Applicant Address: CN Beijing CN Beijing
- Assignee: BOE TECHNOLOGY GROUP CO., LTD.,BEIJING BOE DISPLAY TECHNOLOGY CO., LTD.
- Current Assignee: BOE TECHNOLOGY GROUP CO., LTD.,BEIJING BOE DISPLAY TECHNOLOGY CO., LTD.
- Current Assignee Address: CN Beijing CN Beijing
- Agency: Brooks Kushman P.C.
- Priority: CN201310275057 20130702
- International Application: PCT/CN2013/089646 WO 20131217
- International Announcement: WO2015/000272 WO 20150108
- Main IPC: H01K3/10
- IPC: H01K3/10 ; H01M4/02 ; H01M4/04 ; H05K1/02 ; H05K1/09 ; G02F1/1362 ; B33Y10/00 ; B33Y80/00 ; H05K1/11 ; G02B27/22 ; H05K1/03 ; H05K3/06

Abstract:
An embodiment of the present invention discloses a 3D barrier substrate and a method for manufacturing the same, and a display device in order to improve the utilization of facilities, increase the production efficiency, and decrease the cost of production. The method of manufacturing 3D barrier substrate comprises: forming a transparent electrode thin film on a substrate, and forming a passivation layer on the transparent electrode thin film; forming an transparent electrode and a passivation layer via hole by a patterning process, wherein the via hole is used for coupling the transparent electrode to the signal line; and forming a signal line, wherein the signal line is coupled to the transparent electrode through the via hole.
Public/Granted literature
- US20150194660A1 3D BARRIER SUBSTRATE, MANUFACTURING METHOD THEREOF AND DISPLAY DEVICE Public/Granted day:2015-07-09
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