Invention Grant
- Patent Title: Multilayer circuit substrate
- Patent Title (中): 多层电路基板
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Application No.: US14701171Application Date: 2015-04-30
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Publication No.: US09590288B2Publication Date: 2017-03-07
- Inventor: Tetsuo Saji , Hiroshi Nakamura
- Applicant: TAIYO YUDEN CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: TAIYO YUDEN CO., LTD.
- Current Assignee: TAIYO YUDEN CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Chen Yoshimura LLP
- Priority: JP2013-081237 20130409; JP2014-095244 20140502
- Main IPC: H01F3/08
- IPC: H01F3/08 ; H01P3/08 ; H01P3/00 ; H05K1/02

Abstract:
A multilayer circuit substrate includes: a first signal line and a first ground conductor formed in a first conductive layer; and a second signal line and a second ground conductor formed in a second conductive layer, the second conductive layer facing the first conductive layer across an insulating layer. The first signal line intersects with the second signal line in a plan view of the multilayer circuit substrate, a space between the first ground conductor and first signal line is smaller in an intersection area of the first and second signal lines than a space in a non-intersection area, a space between the second ground conductor and second signal line is smaller in the intersection area than a space in the non-intersection area, and the first signal line is formed at a smaller line width in the intersection area than in the non-intersection area.
Public/Granted literature
- US20150236393A1 MULTILAYER CIRCUIT SUBSTRATE Public/Granted day:2015-08-20
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