Invention Grant
US09590318B2 Modular design of a high power, low passive intermodulation, active universal distributed antenna system interface tray
有权
模块化设计的大功率，低无源互调，主动通用分布式天线系统接口托盘
- Patent Title: Modular design of a high power, low passive intermodulation, active universal distributed antenna system interface tray
- Patent Title (中): 模块化设计的大功率，低无源互调，主动通用分布式天线系统接口托盘
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Application No.: US14779635Application Date: 2014-07-24
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Publication No.: US09590318B2Publication Date: 2017-03-07
- Inventor: Nader Famili , Purna C. Subedi , Yatin Buch , Jason Cook , Changru Zhu , George Sideris , Robert Balue
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwegman Lundberg & Woessner, P.A.
- International Application: PCT/IB2014/001957 WO 20140724
- International Announcement: WO2015/011562 WO 20150129
- Main IPC: H05K5/00
- IPC: H05K5/00 ; H01Q21/00 ; H01P1/213 ; H05K7/14 ; H04B1/525
Abstract:
A modular high power, low passive intermodulation, active, universal, distributed antenna system interface tray that includes one or more front-end RF frequency duplexers instead of a high power, low passive intermodulation attenuator to achieve superior FIM performance. A cable switch matrix allows for the use of the system among varying power levels* and accomplishes the above in a modular architecture.
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