Invention Grant
- Patent Title: Electrical connector having wafers
- Patent Title (中): 具有晶片的电连接器
-
Application No.: US14736895Application Date: 2015-06-11
-
Publication No.: US09590337B2Publication Date: 2017-03-07
- Inventor: Kyle Gary Annis , Lynn Robert Sipe , Dustin Carson Belack , Matthew Richard McAlonis , Graham Harry Smith, Jr.
- Applicant: Tyco Electronics Corporation
- Applicant Address: US PA Berwyn
- Assignee: TE CONNECTIVITY CORPORATION
- Current Assignee: TE CONNECTIVITY CORPORATION
- Current Assignee Address: US PA Berwyn
- Main IPC: H01R13/40
- IPC: H01R13/40 ; H01R12/79 ; H01R13/52 ; H01R13/6581

Abstract:
An electrical connector includes a housing having a cavity. A wafer stack is received in the cavity. The wafer stack includes a plurality of electrical wafers arranged parallel to each other within the cavity. Each wafer includes a first edge and a second edge. Each wafer includes at least one trace between the first and second edges. The electrical connector includes a flex harness including a plurality of flexible printed circuit boards (FPCBs). The FPCBs are electrically connected to corresponding wafers.
Public/Granted literature
- US20160365661A1 ELECTRICAL CONNECTOR HAVING WAFERS Public/Granted day:2016-12-15
Information query