Invention Grant
- Patent Title: Low profile connector system
- Patent Title (中): 薄型连接器系统
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Application No.: US14744619Application Date: 2015-06-19
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Publication No.: US09590353B2Publication Date: 2017-03-07
- Inventor: Kent E. Regnier , Steven George Sutter , Darian Schulz
- Applicant: Molex, LLC
- Applicant Address: US IL Lisle
- Assignee: Molex, LLC
- Current Assignee: Molex, LLC
- Current Assignee Address: US IL Lisle
- Agent Stephen L. Sheldon
- Main IPC: H01R12/72
- IPC: H01R12/72 ; H01R13/646 ; H01R13/648 ; H01R13/627 ; H01R24/62 ; H01R12/70 ; H01R13/6471 ; H01R13/6473 ; H01R24/60 ; H01R13/6582 ; H01R107/00

Abstract:
A connector system is disclosed that can support high data rates over a connector with terminals on a 0.5 mm pitch. A plug connector can include a termination module that has a paddle card and a plug module that includes rows of terminals. The termination module and the plug module can be aligned via the row of terminals and pads on the paddle card. A receptacle connector includes two rows of terminals that are provided on opposite sides of a tongue. The tongue includes impedance notches aligned with terminals arranged as differential pairs. Ground terminals extend past the differential pairs and along the impedance notch.
Public/Granted literature
- US20150288104A1 LOW PROFILE CONNECTOR SYSTEM Public/Granted day:2015-10-08
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