Invention Grant
- Patent Title: Array substrate and method of mounting integrated circuit using the same
- Patent Title (中): 阵列基板和使用其集成电路的安装方法
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Application No.: US14526182Application Date: 2014-10-28
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Publication No.: US09591754B2Publication Date: 2017-03-07
- Inventor: Dae Geun Lee
- Applicant: Samsung Display Co., Ltd.
- Applicant Address: KR Yongin-si
- Assignee: Samsung Display Co., Ltd.
- Current Assignee: Samsung Display Co., Ltd.
- Current Assignee Address: KR Yongin-si
- Agency: H.C. Park & Associates, PLC
- Priority: KR10-2014-0073756 20140617
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H05K1/11 ; G02F1/1345 ; H05K1/18
Abstract:
An array substrate including a display area and a non-display area surrounding the display area. The non-display area includes a pad portion including one or more first pads that each have a parallelogram shape.
Public/Granted literature
- US20150366049A1 ARRAY SUBSTRATE AND METHOD OF MOUNTING INTEGRATED CIRCUIT USING THE SAME Public/Granted day:2015-12-17
Information query
IPC分类:
