Invention Grant
- Patent Title: High-frequency package
- Patent Title (中): 高频包装
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Application No.: US14119295Application Date: 2012-01-12
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Publication No.: US09591756B2Publication Date: 2017-03-07
- Inventor: Tomoyuki Unno , Kazuyoshi Inami , Kosuke Yasooka
- Applicant: Tomoyuki Unno , Kazuyoshi Inami , Kosuke Yasooka
- Applicant Address: JP Tokyo
- Assignee: Mitsubishi Electric Corporation
- Current Assignee: Mitsubishi Electric Corporation
- Current Assignee Address: JP Tokyo
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2011-115665 20110524
- International Application: PCT/JP2012/050501 WO 20120112
- International Announcement: WO2012/160837 WO 20121129
- Main IPC: H05K1/11
- IPC: H05K1/11 ; H05K1/02 ; H05K1/18 ; H01L23/498 ; H01L23/66 ; H01P5/02 ; H01P5/08

Abstract:
In a multilayer substrate, a quasi-coaxial line is formed as a structure for transmitting a high-frequency signal generated by a mounted high-frequency device from an uppermost layer to a lowermost layer to externally output and for transmitting an externally input high-frequency signal from the lowermost layer to the high-frequency device. The quasi-coaxial line has: a central conductor being a vertical through hole via that connects between a metal pattern formed on an upper surface of the uppermost layer and a metal pattern formed on a lower surface of the lowermost layer; and outer conductors being a plurality of interlayer vias that are circularly arranged around the central conductor and connect between two or more layers. Whole or a part of the vertical through hole via is substituted by a capacitor structure formed of conductor pads facing each other without any via.
Public/Granted literature
- US20140069706A1 HIGH-FREQUENCY PACKAGE Public/Granted day:2014-03-13
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