Invention Grant
- Patent Title: Component supplying apparatus and component supplying method
- Patent Title (中): 零部件供给装置及部件供给方法
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Application No.: US14322059Application Date: 2014-07-02
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Publication No.: US09592986B2Publication Date: 2017-03-14
- Inventor: Minoru Kitani , Kazunori Kanai , Kazuo Kido , Seikou Abe , Motohiro Higuchi , Shigeru Matsukawa
- Applicant: Panasonic Corporation
- Applicant Address: JP Osaka
- Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Current Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Current Assignee Address: JP Osaka
- Agency: Wenderoth, Lind & Ponack, L.L.P.
- Priority: JP2013-159353 20130731; JP2014-031855 20140221
- Main IPC: B65H20/20
- IPC: B65H20/20

Abstract:
A component supplying apparatus comprises a tape guide surface facing a lower surface of the carrier tape, a preceding tape contact part climbing onto a upper surface of the preceding carrier tape, and a subsequent tape blocking part configured to wait on the upstream side of the preceding tape contact part in a tape feeding direction while keeping a distance from the tape guide surface so as to enable the carrier tape to pass between the subsequent tape blocking part and the tape guide surface, and to move downwardly toward the preceding carrier tape when the preceding tape contact part is climbed onto the preceding carrier tape. The subsequent tape blocking part keeps the subsequent carrier tape waiting by contacting a front end of the subsequent carrier tape stacked on the preceding carrier tape onto which the preceding tape contact part climbs.
Public/Granted literature
- US20150034692A1 COMPONENT SUPPLYING APPARATUS AND COMPONENT SUPPLYING METHOD Public/Granted day:2015-02-05
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