Invention Grant
- Patent Title: Hydrogenated amorphous silicon dielectric for superconducting devices
- Patent Title (中): 用于超导器件的氢化非晶硅电介质
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Application No.: US14145337Application Date: 2013-12-31
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Publication No.: US09593414B2Publication Date: 2017-03-14
- Inventor: Sergey Barabash , Chris Kirby , Dipankar Pramanik , Andrew Steinbach
- Applicant: Intermolecular, Inc.
- Applicant Address: US CA San Jose US VA Falls Church
- Assignee: Intermolecular, Inc.,Northrop Grumman Systems Corporation
- Current Assignee: Intermolecular, Inc.,Northrop Grumman Systems Corporation
- Current Assignee Address: US CA San Jose US VA Falls Church
- Main IPC: H01L21/00
- IPC: H01L21/00 ; C23C16/24 ; C23C16/56 ; C23C14/14 ; C23C14/58 ; H01J37/32 ; H01J37/34

Abstract:
Amorphous silicon (a-Si) is hydrogenated for use as a dielectric (e.g., an interlayer dielectric) for superconducting electronics. A hydrogenated a-Si layer is formed on a substrate by CVD or sputtering. The hydrogen may be integrated during or after the a-Si deposition. After the layer is formed, it is first annealed in an environment of high hydrogen chemical potential and subsequently annealed in an environment of low hydrogen chemical potential. Optionally, the a-Si (or an H-permeable overlayer, if added) may be capped with a hydrogen barrier before removing the substrate from the environment of low hydrogen chemical potential.
Public/Granted literature
- US20150184286A1 Hydrogenated Amorphous Silicon Dielectric for Superconducting Devices Public/Granted day:2015-07-02
Information query
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