Invention Grant
- Patent Title: Spring contact for semiconductor chip
- Patent Title (中): 半导体芯片的弹簧触点
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Application No.: US14926258Application Date: 2015-10-29
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Publication No.: US09595502B2Publication Date: 2017-03-14
- Inventor: Olaf Hohlfeld , Edward Fuergut , Horst Groeninger , Juergen Hoegerl
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Dicke, Billig & Czaja, PLLC
- Priority: DE102014222189 20141030
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/00 ; H01L23/433 ; H01L29/739 ; H01L23/31 ; H01L21/56
Abstract:
A semiconductor assembly is described. In accordance with one example of the invention, the semiconductor assembly comprises a semiconductor body, a top main electrode arranged on a top side, a bottom main electrode arranged on an underside, and a control electrode arranged on the top side. The semiconductor assembly further includes a spring element for the pressure contacting of the control electrode with a pressure force generated by the spring element.
Public/Granted literature
- US20160126211A1 SEMICONDUCTOR ARRANGEMENT, METHOD FOR PRODUCING A SEMICONDUCTOR CHIP Public/Granted day:2016-05-05
Information query
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